Browse Prior Art Database

Multiprobe Testing Device

IP.com Disclosure Number: IPCOM000090989D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Eddy, MR: AUTHOR

Abstract

Testing of printed circuit patterns having possible surface irregularities is accomplished with test probes 1 and 2. These are bound to carrier 3 by resilient binding material 4. Some areas on the circuit pattern to be tested can be higher than other areas. If a test probe contacts an irregular surface area, binding 4 allows the probe to give slightly. This resiliency allows all probes to make firm contact with the circuit areas to be tested.

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Multiprobe Testing Device

Testing of printed circuit patterns having possible surface irregularities is accomplished with test probes 1 and 2. These are bound to carrier 3 by resilient binding material 4. Some areas on the circuit pattern to be tested can be higher than other areas. If a test probe contacts an irregular surface area, binding 4 allows the probe to give slightly. This resiliency allows all probes to make firm contact with the circuit areas to be tested.

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