Browse Prior Art Database

Method of Bonding

IP.com Disclosure Number: IPCOM000090995D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Surty, RJ: AUTHOR [+2]

Abstract

Insulated wire 1 is stripped of insulation and ultrasonically bound to land 6 by the use of a single tool. Insulated wire 1 is held in groove 2 of ultrasonic bonding tip 3. This has a coating of penetrating metallic paste 4, e.g., deep penetrating tungsten. Current is supplied to paste 4 via lead 5. The passage of current through paste 4 heats tip 3, thermally stripping the insulation from wire 1. Ultrasonic vibration horn 6 is then energized, completing the bonding process of wire 1 to the required circuit board location.

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Method of Bonding

Insulated wire 1 is stripped of insulation and ultrasonically bound to land 6 by the use of a single tool. Insulated wire 1 is held in groove 2 of ultrasonic bonding tip 3. This has a coating of penetrating metallic paste 4, e.g., deep penetrating tungsten. Current is supplied to paste 4 via lead 5. The passage of current through paste 4 heats tip 3, thermally stripping the insulation from wire 1. Ultrasonic vibration horn 6 is then energized, completing the bonding process of wire 1 to the required circuit board location.

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