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Tinning Closely Spaced Leads

IP.com Disclosure Number: IPCOM000090996D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Miller, BW: AUTHOR

Abstract

Excess solder is removed from an electrical element's leads in preparation for solder reflow bonding of the element to a circuit board. The excess solder is removed by a jet of hot oil. The first step in a solder reflow operation is the coating with solder of the leads to be bound. This step is performed by immersing the leads in a fountain of molten solder. However, this immersion causes an excessive amount of solder to coat the leads. This excessive coating is removed by a stream of hot oil 1 which is directed at the top surface of leads 4. Solder 2 is melted and carried away by oil jet 1. Since the undersides of leads 4 are not in direct contact with oil 1, these undersides retain a small bead of solder. This bead is in the proper location on the lead for an optimum solder reflow bond of leads 4 to a circuit board.

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Tinning Closely Spaced Leads

Excess solder is removed from an electrical element's leads in preparation for solder reflow bonding of the element to a circuit board. The excess solder is removed by a jet of hot oil. The first step in a solder reflow operation is the coating with solder of the leads to be bound. This step is performed by immersing the leads in a fountain of molten solder. However, this immersion causes an excessive amount of solder to coat the leads. This excessive coating is removed by a stream of hot oil 1 which is directed at the top surface of leads 4. Solder 2 is melted and carried away by oil jet 1. Since the undersides of leads 4 are not in direct contact with oil 1, these undersides retain a small bead of solder. This bead is in the proper location on the lead for an optimum solder reflow bond of leads 4 to a circuit board.

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