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Reducing the Shrinkage of Resins During Curing

IP.com Disclosure Number: IPCOM000091028D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Pirog, J: AUTHOR

Abstract

Laminates are prepared by a bilamination technique which tends to minimize warpage of the laminate during the curing of an epoxy resin. A first resinous material 2, having a low accelerator content is coated on substrate 1. A second resinous material 3, which can or may not be the same as material 2, is coated atop material 2. During curing, mate material 3 is rapidly hardened and undergoes shrinkage. Shrinkage occurs without distorting substrate 1. This is because material 2 is still fluid, preventing formation of stress build-up between material 3 and substrate 1. When material 3 is sufficiently hardened, material 2 begins to harden and forms an adhesive bond between the hardened material 3 and substrate 1.

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Reducing the Shrinkage of Resins During Curing

Laminates are prepared by a bilamination technique which tends to minimize warpage of the laminate during the curing of an epoxy resin. A first resinous material 2, having a low accelerator content is coated on substrate 1. A second resinous material 3, which can or may not be the same as material 2, is coated atop material 2. During curing, mate material 3 is rapidly hardened and undergoes shrinkage. Shrinkage occurs without distorting substrate 1. This is because material 2 is still fluid, preventing formation of stress build-up between material 3 and substrate 1. When material 3 is sufficiently hardened, material 2 begins to harden and forms an adhesive bond between the hardened material 3 and substrate 1.

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