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Via Hole Filling Technique

IP.com Disclosure Number: IPCOM000091030D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Eurglunes, FW: AUTHOR

Abstract

This technique is for filling the via holes in a printed circuit board. This is effected in such a manner as to allow for through-board electrical conduction and to eliminate the possibility of doming or voids caused by heat expansion or contraction of the filling material. Via hole 1 of a printed circuit board is to be filled. The sides of hole 1 are plated. Pin 2, made of electrically conductive material, is inserted in hole 1. Pin 2 is placed in hole 1 in such a manner that the topmost surface of the pin is flush with the top surface of the printed circuit board. Liquid solder is then screened onto the surface of pin 2 and the printed circuit board. The capillary action of the liquid solder causes the solder to fill the annular gap which exists between the surface of pin 2 and the surface of hole 1.

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Via Hole Filling Technique

This technique is for filling the via holes in a printed circuit board. This is effected in such a manner as to allow for through-board electrical conduction and to eliminate the possibility of doming or voids caused by heat expansion or contraction of the filling material. Via hole 1 of a printed circuit board is to be filled. The sides of hole 1 are plated. Pin 2, made of electrically conductive material, is inserted in hole 1. Pin 2 is placed in hole 1 in such a manner that the topmost surface of the pin is flush with the top surface of the printed circuit board. Liquid solder is then screened onto the surface of pin 2 and the printed circuit board. The capillary action of the liquid solder causes the solder to fill the annular gap which exists between the surface of pin 2 and the surface of hole 1. After the solder liquifies, the surface of the board can be ground to form a smooth polished surface. The board is then ready for plating and further processing.

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