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Reduction of Shrinkage During the Curing of Epoxy Films by the Addition of Foaming Agents

IP.com Disclosure Number: IPCOM000091041D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, R: AUTHOR [+4]

Abstract

This epoxy resin formulation has reduced shrinkage during a curing stage. A conventional resin in a suitable solvent is formulated with a foaming agent. The foaming agent can be selected from Azo compounds, N-nitroso compounds, sulfonyl hydrazide, and inorganic salts, such as ammonium bicarbonate and sodium bicarbonates. During a curing stage, the foaming agent decomposes to form a gas which creates a microcellular structure throughout the cured epoxy resin. this microcellular structure acts to minimize shrinkage of the cured resin. The rate of gas formation is critical and can be adjusted by varying the foaming agent concentration, temperature, and activator.

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Reduction of Shrinkage During the Curing of Epoxy Films by the Addition of Foaming Agents

This epoxy resin formulation has reduced shrinkage during a curing stage. A conventional resin in a suitable solvent is formulated with a foaming agent. The foaming agent can be selected from Azo compounds, N-nitroso compounds, sulfonyl hydrazide, and inorganic salts, such as ammonium bicarbonate and sodium bicarbonates. During a curing stage, the foaming agent decomposes to form a gas which creates a microcellular structure throughout the cured epoxy resin. this microcellular structure acts to minimize shrinkage of the cured resin. The rate of gas formation is critical and can be adjusted by varying the foaming agent concentration, temperature, and activator.

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