Browse Prior Art Database

Electroplated Magnetic Thin Film Head

IP.com Disclosure Number: IPCOM000091058D
Original Publication Date: 1969-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Schneider, R: AUTHOR

Abstract

Improved batch fabrication of magnetic thin-film single- or multitrack heads is realized by substituting the conventional vacuum deposition process by permalloy electroplating on a Cu substrate. The fabrication process of the head comprises these steps. 1. Fixing a Cu-foil in a metal frame. The thickness of the Cu-foil is 1 mu which equals the nominal slit width of the U-shaped magnetic permalloy core. 2. Etching holes A by photoresist techniques. 3. Photoresist-coating the Cu-foil on both sides with the exception of areas B, the photoresist withstanding 30 minutes immersion in a plating bath. 4. Electroplating the permalloy core onto the bare areas up to a thickness of 1.5 mu. The Cu-foil is held as a cathode between two anodes within an Ni-Fe-B electrolyte with additional organic components. 5.

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Electroplated Magnetic Thin Film Head

Improved batch fabrication of magnetic thin-film single- or multitrack heads is realized by substituting the conventional vacuum deposition process by permalloy electroplating on a Cu substrate. The fabrication process of the head comprises these steps. 1. Fixing a Cu-foil in a metal frame. The thickness of the Cu-foil is 1 mu which equals the nominal slit width of the U-shaped magnetic permalloy core. 2. Etching holes A by photoresist techniques. 3. Photoresist- coating the Cu-foil on both sides with the exception of areas B, the photoresist withstanding 30 minutes immersion in a plating bath. 4. Electroplating the permalloy core onto the bare areas up to a thickness of 1.5 mu. The Cu-foil is held as a cathode between two anodes within an Ni-Fe-B electrolyte with additional organic components. 5. Removing the photoresist and cutting the foil along lines X and Y. The final form of one head, which includes the U-shaped permalloy layer B', is represented by areas C1, B', and C2. The Cu-foil can be strengthened by copper plating, if required. 6. Fixing the head within a slider and contacting it by soldering within the Cu areas C1 and C2.

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