Browse Prior Art Database

Organic Ground Plane

IP.com Disclosure Number: IPCOM000091100D
Original Publication Date: 1969-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Graham, AE: AUTHOR [+2]

Abstract

A liquid solution of thermoset resins containing conductive particles is employed to provide a thin antistatic conductive coating for an organic photoconductive element.

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Organic Ground Plane

A liquid solution of thermoset resins containing conductive particles is employed to provide a thin antistatic conductive coating for an organic photoconductive element.

The solution has this formulation.

Component Parts by Weight Carbon Black 16.0
Polyurethane Precursor Polyester 16.0

Polyisocyanate 20.0

Solution Vinyl (Polyvinyl Chloride-Polyvinyl Acetate) 36.0

Silicone Oil 0.04

Methyl Ethyl Ketone 227.0.

The solution is coated on a substrate such as polyester film and heated to remove the solvent and cure the resins.

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