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Browse Prior Art Database

Process for Constructing Through Conductors

IP.com Disclosure Number: IPCOM000091110D
Original Publication Date: 1969-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cutillo, JG: AUTHOR [+2]

Abstract

Electrical through conductors in holes in insulative substrates can be formed quickly and efficiently by using electrophoretic deposition and subsequent fusing of the conductive metal. As an example, holes in a ceramic substrate are filled with silver to produce a solid pin. An insulative, drilled substrate is attached to a conductive base and immersed in an electrophoretic suspension. The suspension can be powdered silver mixed with deionized water, an ionic surfactant, and an electrocoating resin. Cathodes are also immersed and the substrate and base are made anodic. Under an applied potential, silver fills the holes. The substrate is removed from the bath end base, placed in an oven, and fired at a temperature to reflow the silver.

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Process for Constructing Through Conductors

Electrical through conductors in holes in insulative substrates can be formed quickly and efficiently by using electrophoretic deposition and subsequent fusing of the conductive metal. As an example, holes in a ceramic substrate are filled with silver to produce a solid pin. An insulative, drilled substrate is attached to a conductive base and immersed in an electrophoretic suspension. The suspension can be powdered silver mixed with deionized water, an ionic surfactant, and an electrocoating resin. Cathodes are also immersed and the substrate and base are made anodic. Under an applied potential, silver fills the holes. The substrate is removed from the bath end base, placed in an oven, and fired at a temperature to reflow the silver. Organic materials are driven off during firing, leaving a substantially solid conductive pin.

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