Browse Prior Art Database

Microelectronic Packaging

IP.com Disclosure Number: IPCOM000091114D
Original Publication Date: 1969-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Bleher, JH: AUTHOR [+3]

Abstract

These are microelectronic packaging assemblies for liquid-cooled modules. In A, heat producing semiconductive chips 11 are bonded to the surface of ceramic substrate 12. Metal container 13, with interior and exterior fins to increase the surface area, is mounted directly on substrate 12. Container 13 is cemented to substrate 12 with silicone rubber cement, a solder paste, or the like. Alternatively, the edges of substrate 12 can be metallized with a screened metal paste or by electroless nickel plating. Then container B can be soldered to this edge pattern. As shown at B, filler hole 14 in the top of container 13 is closed by flexible rubber sheet 15 which prevents spillage and acts as a safety valve in case of overheating of the Liquid.

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Microelectronic Packaging

These are microelectronic packaging assemblies for liquid-cooled modules. In A, heat producing semiconductive chips 11 are bonded to the surface of ceramic substrate 12. Metal container 13, with interior and exterior fins to increase the surface area, is mounted directly on substrate 12. Container 13 is cemented to substrate 12 with silicone rubber cement, a solder paste, or the like. Alternatively, the edges of substrate 12 can be metallized with a screened metal paste or by electroless nickel plating. Then container B can be soldered to this edge pattern. As shown at B, filler hole 14 in the top of container 13 is closed by flexible rubber sheet 15 which prevents spillage and acts as a safety valve in case of overheating of the Liquid.

In C, the entire container 23 is flexible, being made of thin-walled stainless steel, beryllium copper, aluminum, etc. The walls are circumferentially crimped like a bellows forming, together with the substrate to which it is cemented, a closed system. Upon overheating of the coolant, container 23 expands to come in contact with a contact member 26 to shut the power off, sound an alarm or come in contact with a heat sink which provides additional cooling.

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