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Fabrication of Grooved Bonding Tips

IP.com Disclosure Number: IPCOM000091137D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Ho, VT: AUTHOR [+2]

Abstract

An ultrasonic bonding tip has to have a groove cut in it in order that the wire to be bonded is held firmly. Drawing 1 shows ultrasonic bonding tip 1 having groove 2. Groove 2 is rounded at either end in order that the wire, which fits into groove 2, is not cut by any sharp edges which otherwise are present. Drawing 2 shows a method of cutting this rounded groove in an ultrasonic bonding tip. The flat middle portion of the groove is created by moving the tip in a horizontal mode beneath a rotating grinding wheel 3 as in 2a. Tip 4 is placed in contact with wheel 3 and moved back and forth so that a straight groove is cut. Drawing 2b shows tip 4 tilted to the right and rotated beneath grinding wheel 3. Similarly, drawing 2c shows tip 4 tilted to the left and rotated beneath wheel 3.

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Fabrication of Grooved Bonding Tips

An ultrasonic bonding tip has to have a groove cut in it in order that the wire to be bonded is held firmly. Drawing 1 shows ultrasonic bonding tip 1 having groove 2. Groove 2 is rounded at either end in order that the wire, which fits into groove 2, is not cut by any sharp edges which otherwise are present. Drawing 2 shows a method of cutting this rounded groove in an ultrasonic bonding tip.

The flat middle portion of the groove is created by moving the tip in a horizontal mode beneath a rotating grinding wheel 3 as in 2a.

Tip 4 is placed in contact with wheel 3 and moved back and forth so that a straight groove is cut. Drawing 2b shows tip 4 tilted to the right and rotated beneath grinding wheel 3. Similarly, drawing 2c shows tip 4 tilted to the left and rotated beneath wheel 3. The rotation mode of grinding causes the groove to have curved edges. Drawing 3 shows a device which is capable of carrying out this method. Ultrasonic bonding tip 10 is mounted in triangular holder 11 which is firmly positioned in support arm 12. The latter is mounted in slide base 13. Arm 12 can move in a horizontal manner along base
13. Driving base 13 is drive shaft 14. This rotates alternately in clockwise and counterclockwise directions. The entire mechanism is positioned below grinding wheel 15. Such wheel is placed in contact with tip 10 and grinding takes place as in drawing 2.

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