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Tapered Ultrasonic Bonding Tip

IP.com Disclosure Number: IPCOM000091138D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Dushkes, SZ: AUTHOR

Abstract

The slender construction of a conventional ultrasonic bonding tip, drawing A, causes vibrational nodes to occur along the length of the tip shaft. The waveform depicts tip displacement as a function of position along tip length for the conventional bonding tip and shows that nodes exist at points 2 and 3. Due to changes in the environment, the nodes along the shaft length can move. If a node, for example, node 3, shifts slightly, it appears at the end point of tip 1. A node at this end point causes a failure to bond. A tapered tip, drawing B, eliminates shaft length nodes entirely. Tapered tip 4 has no nodes along its shaft length as seen in the tip displacement waveform. Changes in the environment therefore do not endanger bonding capability.

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Tapered Ultrasonic Bonding Tip

The slender construction of a conventional ultrasonic bonding tip, drawing A, causes vibrational nodes to occur along the length of the tip shaft. The waveform depicts tip displacement as a function of position along tip length for the conventional bonding tip and shows that nodes exist at points 2 and 3. Due to changes in the environment, the nodes along the shaft length can move. If a node, for example, node 3, shifts slightly, it appears at the end point of tip 1. A node at this end point causes a failure to bond.

A tapered tip, drawing B, eliminates shaft length nodes entirely. Tapered tip 4 has no nodes along its shaft length as seen in the tip displacement waveform. Changes in the environment therefore do not endanger bonding capability. Since the tip is tapered, it possesses to some degree the high penetration capability of the slender tip while maintaining relative inflexibility.

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