Browse Prior Art Database

Capacitor Soldering Tool

IP.com Disclosure Number: IPCOM000091142D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Nickols, SE: AUTHOR [+2]

Abstract

A thermally efficient solder reflow device is constructed by laminating a nickel-chrome heater element with copper power conductors. Capacitor 1 is to be bound to circuit board pads 2 by heating and thus reflowing the thin layer of solder which coats capacitor caps 3. Heater elements 4, which are constructed of 80% nickel-20% chrome, clamp capacitor 1 and position it on pads 2. Each heater 4 has two copper power conductors positioned along one side. Current passes down power conductor 6 to tip 8 of heater 4, passes, highly concentrated, through tip 8, and then returns to source 5 through power conductor 7. The high concentration of current which flows through tip 8 of heater 4 causes the tip to rapidly heat caps 3, thus reflowing the solder coating and, consequently, bonding capacitor 1 to pads 2.

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Capacitor Soldering Tool

A thermally efficient solder reflow device is constructed by laminating a nickel-chrome heater element with copper power conductors. Capacitor 1 is to be bound to circuit board pads 2 by heating and thus reflowing the thin layer of solder which coats capacitor caps 3. Heater elements 4, which are constructed of 80% nickel-20% chrome, clamp capacitor 1 and position it on pads 2. Each heater 4 has two copper power conductors positioned along one side. Current passes down power conductor 6 to tip 8 of heater 4, passes, highly concentrated, through tip 8, and then returns to source 5 through power conductor 7. The high concentration of current which flows through tip 8 of heater 4 causes the tip to rapidly heat caps 3, thus reflowing the solder coating and, consequently, bonding capacitor 1 to pads 2. Nickel-chrome is used as the heater because of its relative high resistance and because of the fact that it is nonwettable by solder after its surface is oxidized. Because of the high thermal efficiency of the device, heat sensitive elements, such as caps 3 and the epoxy substrates in the circuit board, remain unharmed during the bonding operation.

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