Browse Prior Art Database

Potting and Encapsulating Compound

IP.com Disclosure Number: IPCOM000091144D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hawkins, CR: AUTHOR [+4]

Abstract

This resin system useful for bonding ceramic parts. The system is a mineral-filled epoxy resin and hardener that can be cured at low temperatures to produce good mechanical stability and bond to the ceramic surfaces. The mineral filler produces the desired viscosity for dispensing and has low-thermal expansion and good grinding and lapping properties. The hardener reacts with the epoxy resin both additively and catalytically, producing a compound with a high-glass transition temperature even though a low-cure temperature is used. Formulation Parts By Wt. Calcium carbonate (VICRON* 45-3) 70 Epoxy (EPON** 826) 30 Hardener (2 ethyl-4 methyl-midazole) 1.2 *Trademark of Chas. Pfizer and Co.

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Potting and Encapsulating Compound

This resin system useful for bonding ceramic parts. The system is a mineral-filled epoxy resin and hardener that can be cured at low temperatures to produce good mechanical stability and bond to the ceramic surfaces. The mineral filler produces the desired viscosity for dispensing and has low-thermal expansion and good grinding and lapping properties. The hardener reacts with the epoxy resin both additively and catalytically, producing a compound with a high-glass transition temperature even though a low-cure temperature is used. Formulation Parts By Wt.

Calcium carbonate (VICRON* 45-3) 70

Epoxy (EPON** 826) 30

Hardener (2 ethyl-4 methyl-midazole) 1.2 *Trademark of Chas. Pfizer and Co. **Trademark of Shell Chemical Co.

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