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Component Cooling Apparatus

IP.com Disclosure Number: IPCOM000091201D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Poliak, RM: AUTHOR [+2]

Abstract

This air cooling apparatus is used to cool heat-sensitive components attached to printed circuit cards or printed circuit boards either during assembly or rework operations or both. The apparatus includes the equipping of air lines with a Venturi supplied with a low boiling coolant to introduce the coolant into the air stream. A reduction of the velocity in the air flow enables the air to become saturated with a vapor mist of the coolant. This arrangement enables an appreciable reduction in the air flow velocity with an attendant increased cooling factor of several magnitudes. Thus, improved cooling of heat sensitive components during assembly and rework operations is realized.

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Component Cooling Apparatus

This air cooling apparatus is used to cool heat-sensitive components attached to printed circuit cards or printed circuit boards either during assembly or rework operations or both. The apparatus includes the equipping of air lines with a Venturi supplied with a low boiling coolant to introduce the coolant into the air stream. A reduction of the velocity in the air flow enables the air to become saturated with a vapor mist of the coolant. This arrangement enables an appreciable reduction in the air flow velocity with an attendant increased cooling factor of several magnitudes. Thus, improved cooling of heat sensitive components during assembly and rework operations is realized.

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