Browse Prior Art Database

Electro Optical Probe

IP.com Disclosure Number: IPCOM000091209D
Original Publication Date: 1969-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Laczko, L: AUTHOR [+2]

Abstract

In fabricating high-performance integrated logic circuits, a plurality of circuit units or chips, having a heatsink on top of each chip, is mounted on a multichip module. A substantial number of pads for connection to the chip circuitry is also mounted on the module. This probe enables any pad on the module to be contacted in the working environment. A plurality of circuit chips with heatsinks 1 is mounted along with a plurality of pads 2 on multichip module 3. The latter is located in enclosure 4. During the operating conditions when power is on, the coolant is boiling and is circulating under pressure. The optical probe is formed of eyepiece 5 connected through flexible coherent fiber-optic 6 to objective lens system 7. Fiber-optic 6 and lens 7 are located within enclosure 4.

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Electro Optical Probe

In fabricating high-performance integrated logic circuits, a plurality of circuit units or chips, having a heatsink on top of each chip, is mounted on a multichip module. A substantial number of pads for connection to the chip circuitry is also mounted on the module. This probe enables any pad on the module to be contacted in the working environment. A plurality of circuit chips with heatsinks 1 is mounted along with a plurality of pads 2 on multichip module 3. The latter is located in enclosure 4. During the operating conditions when power is on, the coolant is boiling and is circulating under pressure. The optical probe is formed of eyepiece 5 connected through flexible coherent fiber-optic 6 to objective lens system 7. Fiber-optic 6 and lens 7 are located within enclosure 4. Lens 7 has electrical probe tip 8 connected through cable 9 to oscilloscope 10. Tip 8 is located within the acceptance angle of lens 7 and is visible through eyepiece 5. X and Y positioners 11 and 12 control the movement of the probe and coarsely position it over the area to be probed. After the area is selected with positioners 11 and 12, the pad to be contacted is further positioned visually using the optical system. Light is provided through light guide 13. After final positioning, Z motion positioner 14 positions probe 8 down to make contact with the selected pad 2.

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