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Photoresist

IP.com Disclosure Number: IPCOM000091235D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bakos, P: AUTHOR [+2]

Abstract

The photoresist composition comprises a photosensitive polychloroprene polymeric material as a matrix to which is added chloronated rubber and/or a metallic oxide, e.g., titanium dioxide, ZnO or MgO and a plasticizer, e.g., dibutyl phalate or diallyl phalate. The composition has the advantages of producing sharp images when exposed to actinic radiation and of reducing swelling in crosslinked areas. There is also a reduction in tackiness of the dried film surface. Additionally, undercuts are reduced during an etching operation.

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Photoresist

The photoresist composition comprises a photosensitive polychloroprene polymeric material as a matrix to which is added chloronated rubber and/or a metallic oxide, e.g., titanium dioxide, ZnO or MgO and a plasticizer, e.g., dibutyl phalate or diallyl phalate. The composition has the advantages of producing sharp images when exposed to actinic radiation and of reducing swelling in crosslinked areas. There is also a reduction in tackiness of the dried film surface. Additionally, undercuts are reduced during an etching operation.

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