Browse Prior Art Database

Sorting Semiconductor Chips

IP.com Disclosure Number: IPCOM000091257D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Martin, EG: AUTHOR [+2]

Abstract

This vibrating bowl apparatus is for sorting semiconductor chips 10 of the type containing three ball-type terminals 11. The apparatus consists of a vibrating bowl having a spiral-grooved ramp terminating in an end track and hole which allows properly fabricated devices to escape from the bowl for further processing. Vibrating bowl 12 has a spiral-grooved ramp 13 having a transverse slope toward the bowl bottom and is adapted to allow the chips to move along it ball side down, as shown. Along ramp 13 is provided a knock-off element 14 overhanging the ramp which prevents chips with ball-type terminals, extending too far from the surface of the chip, from passing. Such off specification chips are raised far enough above ramp 13 to contact element 14. They are knocked from ramp 13 and are returned to the bowl.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Sorting Semiconductor Chips

This vibrating bowl apparatus is for sorting semiconductor chips 10 of the type containing three ball-type terminals 11. The apparatus consists of a vibrating bowl having a spiral-grooved ramp terminating in an end track and hole which allows properly fabricated devices to escape from the bowl for further processing. Vibrating bowl 12 has a spiral-grooved ramp 13 having a transverse slope toward the bowl bottom and is adapted to allow the chips to move along it ball side down, as shown. Along ramp 13 is provided a knock-off element 14 overhanging the ramp which prevents chips with ball-type terminals, extending too far from the surface of the chip, from passing. Such off specification chips are raised far enough above ramp 13 to contact element 14. They are knocked from ramp 13 and are returned to the bowl. Substrates having properly positioned ball terminals pass under element 14 and pass through a cutout portion or hole 15 located beyond element 14 and are then subjected to further processing.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]