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Browse Prior Art Database

Mounting a Semiconductor Chip

IP.com Disclosure Number: IPCOM000091275D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Cozens, AG: AUTHOR [+3]

Abstract

Semiconductor chip 1 is bonded to substrate 2 with its electrodes 3 uppermost. Substrate 2 carries printed wiring 4. Connectors 5 are soldered between electrodes 3 and wiring 4. Sufficient heat is supplied during soldering of one end of connectors 5 in position to cause reflow of solder joints at the other end of the connectors. Slight movement of a connector is thus permitted during the period when solder at both ends of such connector is molten and stresses between the connector and the solder joints are relieved. The solder is confined to the ends of connectors 5 by coating the remainder of the connectors with a layer of chromium 6.

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Mounting a Semiconductor Chip

Semiconductor chip 1 is bonded to substrate 2 with its electrodes 3 uppermost. Substrate 2 carries printed wiring 4. Connectors 5 are soldered between electrodes 3 and wiring 4. Sufficient heat is supplied during soldering of one end of connectors 5 in position to cause reflow of solder joints at the other end of the connectors. Slight movement of a connector is thus permitted during the period when solder at both ends of such connector is molten and stresses between the connector and the solder joints are relieved. The solder is confined to the ends of connectors 5 by coating the remainder of the connectors with a layer of chromium 6.

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