Browse Prior Art Database

Chip Mounting Technique

IP.com Disclosure Number: IPCOM000091281D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Grisely, FG: AUTHOR

Abstract

Any number of semiconductor integrated circuit chips 1 can be simultaneously mounted on board 2 carrying printed wiring 3. A single preform 4 of conductive material has chips 1 secured to it by finger-like extensions 5 which are bonded to the chip terminals. Preform 4 with chips 1 secured to it is lowered onto board 2 with extensions 5 in registry with wiring 3. Chips 1 are bonded to board 2 and bonding tool 6 is lowered to bond extensions 5 to wiring 3. With tool 6 in the lowered position to clamp extensions 5 and if solder reflow is employed with solder still molten, preform 4 is stripped from board 2 leaving extensions 5 connecting the chip terminals to wiring 3. Vacuum chuck 7 can be used to strip and to lift separated preform 4 from board 2.

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Chip Mounting Technique

Any number of semiconductor integrated circuit chips 1 can be simultaneously mounted on board 2 carrying printed wiring 3. A single preform 4 of conductive material has chips 1 secured to it by finger-like extensions 5 which are bonded to the chip terminals. Preform 4 with chips 1 secured to it is lowered onto board 2 with extensions 5 in registry with wiring 3. Chips 1 are bonded to board 2 and bonding tool 6 is lowered to bond extensions 5 to wiring 3. With tool 6 in the lowered position to clamp extensions 5 and if solder reflow is employed with solder still molten, preform 4 is stripped from board 2 leaving extensions 5 connecting the chip terminals to wiring 3. Vacuum chuck 7 can be used to strip and to lift separated preform 4 from board 2. Chuck 7 can be replaced by a tool having adhesive on the surface which contacts preform 4. Cuts or perforations can be provided at the junctions of extensions 5 with preform 4 to assist in their separation.

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