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Decal Interconnection Bonding Method

IP.com Disclosure Number: IPCOM000091291D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Chiou, C: AUTHOR [+6]

Abstract

This method lends itself to mass bonding of decal interconnections on either large modules or multiple smaller modules. The method provides for developing the relatively high pressure necessary to form a thermal compression bond.

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Decal Interconnection Bonding Method

This method lends itself to mass bonding of decal interconnections on either large modules or multiple smaller modules. The method provides for developing the relatively high pressure necessary to form a thermal compression bond.

This bonding method utilizes the crossover points of a wire mesh screen as minute chisels to which force is applied, thus developing the pressures necessary to form bonds. The application of force and heat is concentrated at point contacts in order to bring the metals to the plastic state, thus achieving a thermal compression bond.

Decal 10 having a metallurgy 11 is aligned over substrate 12 and chip 14. Stainless steel mesh 16, or other interface material with a suitable roughness such as 600 grit sand paper, is placed over decal 10. The resultant assembly is introduced into heated press 18.

The latter has a relatively flexible diaphragm 20 over mesh 16. A pressure of approximately 375 psig is applied by the press and the substrate temperature is increased to approximately 310 degrees C. The pressure is then increased to 700-750 psig for 2 minutes and the resultant unit is cooled.

The method can be used to simultaneously bond the decal metallurgy to both the substrate metallurgy 22 and chip 14. Also the bonding can be accomplished in an inert atmosphere if the metallurgy requires it.

An advantage of this system of multiple bonding is that no alignment is necessary between the wire mesh tool and the t...