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Technique to Render Molybdenum Surfaces Solderable

IP.com Disclosure Number: IPCOM000091318D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fink, MS: AUTHOR [+2]

Abstract

Molybdenum and chromium surfaces can be rendered solderable by depositing rhodium, iridium, ruthenium or osmium on them. Molybdenum is currently employed for film lands on silicon chips. Chromium is of use with sputtered quartz or glass in the fabrication of SL transistors. These metals do not react with the lead in the solder very rapidly at soldering temperatures so that little or no embrittlement or other structural weakening occurs. Furthermore, the adhesion between these metals is good.

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Technique to Render Molybdenum Surfaces Solderable

Molybdenum and chromium surfaces can be rendered solderable by depositing rhodium, iridium, ruthenium or osmium on them. Molybdenum is currently employed for film lands on silicon chips. Chromium is of use with sputtered quartz or glass in the fabrication of SL transistors. These metals do not react with the lead in the solder very rapidly at soldering temperatures so that little or no embrittlement or other structural weakening occurs. Furthermore, the adhesion between these metals is good.

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