Browse Prior Art Database

Integrated Circuit Chip Package

IP.com Disclosure Number: IPCOM000091332D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Donaher, CJ: AUTHOR [+2]

Abstract

Integrated circuit chips, such as chip 10, are preferably packaged in a structure providing dimensional stability, electrical connection facility, and cooling. Such a structure is provided by utilizing generally cylindrical metallic plug 12 and rectangular collar 14.

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Integrated Circuit Chip Package

Integrated circuit chips, such as chip 10, are preferably packaged in a structure providing dimensional stability, electrical connection facility, and cooling. Such a structure is provided by utilizing generally cylindrical metallic plug 12 and rectangular collar 14.

Plug 12 has shoulder 16 as well as pedestal 18. Cutting through pedestal 18 and shoulder 16 is groove 20. A grounded electrical connection can be provided to chip 10 through groove 20 by depositing a conductor in it. Collar 14 is mounted on plug 12 by resting it on shoulder 18. Pedestal 18 then fits within the aperture 22 in collar 14. Chip 10 is mounted on pedestal 18 and collar 14.

In order to provide structural rigidity, the entire structure, i.e., collar 14 and chip 10, is glassed over. Collar 14 prevents plug 12 from extending in a lateral direction. Collar 14 is fabricated from a material, e.g., molybdenum, whose coefficient of thermal expansion closely matches that of the semiconductor material in chip 10. The plug 12, which can be copper, is constrained by collar 14, thus eliminating the problems of thermal stress induced in chip 10. A plurality of these arrangements can be mounted on baseboard 24.

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