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Variable Pressure Controller for Substrate Dimpling

IP.com Disclosure Number: IPCOM000091349D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Simms, F: AUTHOR

Abstract

An air-filled bellows can be employed to give an adjustable control on the amount of pressure applied to a semiconductor substrate dimpler. By adjusting the air pressure in the bellows, a precise control on the amount of pressure applied to the substrate by the dimpler is obtained.

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Variable Pressure Controller for Substrate Dimpling

An air-filled bellows can be employed to give an adjustable control on the amount of pressure applied to a semiconductor substrate dimpler. By adjusting the air pressure in the bellows, a precise control on the amount of pressure applied to the substrate by the dimpler is obtained.

The drawing shows a conventional substrate dimpler provided with the air- filled bellows. Attached to support plate 10 is a drive for the dimpler consisting of a rotary drive, not shown, for a positive drive crank 11 attached to the other end of bar 12 having pivot point 13. Dimple punch 14 is attached to the other end of bar 12 by pin 15 which can move over the travel area of socket 16. Air-filled bellows 17 is provided to control the amount of pressure tending to restrain pin 15 from moving in the travel area of socket 16.

Positive drive crank 11 lowers punch 14 until semiconductor substrate 18 is contacted by such punch. Compression of bellows 17 determines the total force exerted on substrate 18. The amount of force exerted on substrate 18 can be increased or decreased by varying the air pressure in bellows 17 by of air supply regulator 19.

In this manner, the amount of pressure can be varied to compensate for varying substrate properties, thus allowing sufficient force for proper dimpling without applying excessive force to damage the substrates.

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