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Browse Prior Art Database

Joining Solder Contacts to Tinned Contact Fingers

IP.com Disclosure Number: IPCOM000091386D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Mele, JJ: AUTHOR

Abstract

The use of disks in the joining of the soft solder contacts of a monolithic chip device to the tinned Contact areas on an insulating substrate reduces the occurrence of voids in the unified joint established during solder reflow. Tinned contact areas 11 in electrode pattern 12 formed on ceramic substrate 13 are defined by glass dam 14. The latter is applied to pattern 12 prior to coating with solder 15 and the surrounding surface portions of substrate 13. When solder contacts 16 of monolithic chip device 17 are joined to areas 11, some voids 18, as in A, are found in the unified joint established during solder reflow. The incidence of voids is greatly diminished by the placement of small metal disks 19 of copper or KOVAR*, as in B, on areas 11 prior to chip placement and solder reflow.

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Joining Solder Contacts to Tinned Contact Fingers

The use of disks in the joining of the soft solder contacts of a monolithic chip device to the tinned Contact areas on an insulating substrate reduces the occurrence of voids in the unified joint established during solder reflow. Tinned contact areas 11 in electrode pattern 12 formed on ceramic substrate 13 are defined by glass dam 14. The latter is applied to pattern 12 prior to coating with solder 15 and the surrounding surface portions of substrate 13. When solder contacts 16 of monolithic chip device 17 are joined to areas 11, some voids 18, as in A, are found in the unified joint established during solder reflow. The incidence of voids is greatly diminished by the placement of small metal disks 19 of copper or KOVAR*, as in B, on areas 11 prior to chip placement and solder reflow. *Trademark of Westinghouse Electric Corporation.

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