Browse Prior Art Database

Snap On Heat Exchanger

IP.com Disclosure Number: IPCOM000091387D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Mulligan, JM: AUTHOR

Abstract

This snap-on heat exchanger greatly increases the heat dissipating capacity of an enclosed electronic component packaging assembly for microminiature modules. Heat exchanger 11 is of unitary construction, typically 10 mil thick beryllium copper which can be folded to a finned member of desired form. Exchanger 11 is then clipped onto an existing component packaging assembly such as the enclosed arrangement 12, shown in phantom, which normally is for use only with microminiature modules employing low-power devices. The addition of exchanger 11 to arrangement 12 decreases external thermal resistance by as much as 40%. In addition, the snap-on feature eliminates the need for a special module for microminiature modules employing high-power devices.

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Snap On Heat Exchanger

This snap-on heat exchanger greatly increases the heat dissipating capacity of an enclosed electronic component packaging assembly for microminiature modules. Heat exchanger 11 is of unitary construction, typically 10 mil thick beryllium copper which can be folded to a finned member of desired form. Exchanger 11 is then clipped onto an existing component packaging assembly such as the enclosed arrangement 12, shown in phantom, which normally is for use only with microminiature modules employing low-power devices. The addition of exchanger 11 to arrangement 12 decreases external thermal resistance by as much as 40%. In addition, the snap-on feature eliminates the need for a special module for microminiature modules employing high-power devices.

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