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Replacement Technique Employing Intermediary Board

IP.com Disclosure Number: IPCOM000091392D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Puttlitz, KJ: AUTHOR [+2]

Abstract

The use of an intermediary board facilitates replacement of portions of an existing electronic assembly. One widely used method of packaging and then assembling an array of electronic components such as tunnel diodes, pulse transformers and the like involves electrically and mechanically joining the components to a pinned ceramic substrate. Then a plurality of these substrates is inserted within and soldered to a mother card or printed circuit board. The pins of the substrate form the mechanical and electrical connections between the individual substrates and the mother card.

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Replacement Technique Employing Intermediary Board

The use of an intermediary board facilitates replacement of portions of an existing electronic assembly. One widely used method of packaging and then assembling an array of electronic components such as tunnel diodes, pulse transformers and the like involves electrically and mechanically joining the components to a pinned ceramic substrate. Then a plurality of these substrates is inserted within and soldered to a mother card or printed circuit board. The pins of the substrate form the mechanical and electrical connections between the individual substrates and the mother card.

It frequently becomes necessary to replace certain portions of these components with new or updated components. This replacement or repopulation can be complicated due to close space tolerances, thermal considerations and the fact that the new components can be of a different geometry than the components being replaced.

A replacement tunnel diode 11, as in A, is provided with ribbon leads 12. In B, leads 12 are welded or soldered to electrode pattern 13 formed on the bottom surface of intermediate glass epoxy board 14. Drawing C shows ceramic substrate 15 having contact pins 16 which are inserted within and soldered to mother card 17. With the old diodes removed from substrate 15, intermediate board 14 bearing new diodes 11 is soldered directly to pins 16. Thin film 18 of insulating tape insulates board 14 from substrate 15 and also acts as...