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Determining the Orientation of a Semiconductor Chip

IP.com Disclosure Number: IPCOM000091396D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Luhrs, G: AUTHOR [+4]

Abstract

The apparatus determines the orientation of a semiconductor chip. Semiconductor chip 10, retained on vacuum probe 11, can have one of four possible orientations. In drawing B,chip 10 which is shown in phantom lines and is capable of the following orientations. The first orientation is that in which apex ball 12 is at the orientation shown in B. Three alternative orientations are respectively displaced 90 degrees, 180 degrees and 270 degrees from the first one. In the orientation shown, ball 12 engages flexible contact 13. In the three possible alternative orientations of chip 10, ball 12 can contact either flexible contact 14, 15 or 16, respectively displaced 90 degrees, 180 degrees and 270 degrees from contact 13.

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Determining the Orientation of a Semiconductor Chip

The apparatus determines the orientation of a semiconductor chip. Semiconductor chip 10, retained on vacuum probe 11, can have one of four possible orientations. In drawing B,chip 10 which is shown in phantom lines and is capable of the following orientations. The first orientation is that in which apex ball 12 is at the orientation shown in B. Three alternative orientations are respectively displaced 90 degrees, 180 degrees and 270 degrees from the first one. In the orientation shown, ball 12 engages flexible contact 13. In the three possible alternative orientations of chip 10, ball 12 can contact either flexible contact 14, 15 or 16, respectively displaced 90 degrees, 180 degrees and 270 degrees from contact 13.

Chip 10, retained on probe 11 in one of the four possible orientations, is moved downward towards sensing structure 17. Depending on the orientation of chip 10, ball 12 engages and depresses either contact 13, 14, 15 or 16. The flexible contacts are laminated structures consisting of insulating layer 18 made of a plastic material, such as polyethylene terephthalate, sandwiched between two layers 19 and 20 made of a metal such as a beryllium copper alloy. For best results, the exposed surfaces of layers 19 and 20 are respectively plated with chrome and gold. The flexible contacts are mounted on supporting layer 21 which is an insulating material separating the contacts from conductive ground plane laye...