Browse Prior Art Database

Determining the Orientation of Articles having Projections

IP.com Disclosure Number: IPCOM000091397D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Mozer, DT: AUTHOR

Abstract

The apparatus determines the orientation of articles, such as semiconductor chips, by sensing the projections or balls on such chips. Standard methods for determining the orientation of chips utilize a series of stationary contacts. The chip is brought into engagement with the stationary contacts. If the chip is properly aligned, the balls of the chip engage corresponding stationary contacts and signals are generated indicative of a correct orientation. In microelectronic components, the balls or projections in the chips being oriented for testing or assembly can vary within acceptable tolerance ranges in the position at which they are attached to the chip. This apparatus distinguishes between chips having such acceptable deviations in the position of the balls from misoriented chips.

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Determining the Orientation of Articles having Projections

The apparatus determines the orientation of articles, such as semiconductor chips, by sensing the projections or balls on such chips. Standard methods for determining the orientation of chips utilize a series of stationary contacts. The chip is brought into engagement with the stationary contacts. If the chip is properly aligned, the balls of the chip engage corresponding stationary contacts and signals are generated indicative of a correct orientation. In microelectronic components, the balls or projections in the chips being oriented for testing or assembly can vary within acceptable tolerance ranges in the position at which they are attached to the chip. This apparatus distinguishes between chips having such acceptable deviations in the position of the balls from misoriented chips.

Contacts 10, 11, and 12, which are to respectively engage balls 13, 14, and 15 of chip 16, are flexible Kelvin contacts. Each Kelvin contact consists of a pair of conducting beams 17 and 18, drawing B, spaced from each other by intermediate layer 19 of insulating material. The end of the beam assembly opposite that contacting the ball of chip 16 is rigidly mounted in cantilever relationship from support 20 through which connections can be made from beams 17 and 18 to an external test circuit. This circuit is completed when a ball of chip 16 engages both beams 17 and 18. A V-shaped recess 21 is formed in each beam assembly be...