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Laminating Procedure

IP.com Disclosure Number: IPCOM000091412D
Original Publication Date: 1968-Jan-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Weikinger, HK: AUTHOR

Abstract

Electrical components and module-carrying cards and boards are manufactured by sandwiching several precured plastic impregnated glass fiber layers between copper foils. Several such panels are processed between the heating pads of a press to serve as the initial material of cards and boards as in the left drawing. This method has the disadvantage that a temperature gradient occurs while processing several laminated panels within a stack, affecting the curing of the panels in the center of the stack. To eliminate this shortcoming, an electric current is applied to flow through the two copper foils of each panel, generating in the copper foils, serving as resistors, the heat required for curing the panels.

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Laminating Procedure

Electrical components and module-carrying cards and boards are manufactured by sandwiching several precured plastic impregnated glass fiber layers between copper foils. Several such panels are processed between the heating pads of a press to serve as the initial material of cards and boards as in the left drawing. This method has the disadvantage that a temperature gradient occurs while processing several laminated panels within a stack, affecting the curing of the panels in the center of the stack. To eliminate this shortcoming, an electric current is applied to flow through the two copper foils of each panel, generating in the copper foils, serving as resistors, the heat required for curing the panels. The copper foils of all panels are connected in series, the copper foils of adjacent panels being paper-insulated against each other as in the right drawing. The heat generated for curing each panel ensure that all panels are uniformly cured and the load cycle time of the press is shortened considerably.

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