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Producing Metallized Art Work

IP.com Disclosure Number: IPCOM000091463D
Original Publication Date: 1968-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Smith, RR: AUTHOR

Abstract

The fabrication of either printed or thin film circuitry, as well as semiconductor devices, frequently requires the initial formation of art work on a substrate. Such art work can be formed directly on glass substrate 10. Initially, nickel film 12 is deposited along the upper surface of substrate 10. Next, copper film 14 is deposited on top of film 12. The upper surface of film 14 is coated with photoresist 16.

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Producing Metallized Art Work

The fabrication of either printed or thin film circuitry, as well as semiconductor devices, frequently requires the initial formation of art work on a substrate. Such art work can be formed directly on glass substrate 10. Initially, nickel film 12 is deposited along the upper surface of substrate 10. Next, copper film 14 is deposited on top of film 12. The upper surface of film 14 is coated with photoresist 16.

In order to form the desired art work geometry, selected areas 18, 20, and 22 are exposed in photoresist 16. These exposed areas 18, 20, and 22 are subsequently etched away. Portions of films 14 and 12 immediately below areas 18, 20, and 22 are also etched away. Next, the remainder of photoresist 16 is washed away.

The final formation of art work uses a gold, or other metallic, plating step. Selected upper portions of film 14, as well as lateral faces of films 14 and 12, are coated with gold. The remaining material can then be etched away leaving the gold patterns 24 and 26.

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