Browse Prior Art Database

Process of Making Coaxial Cable in Place

IP.com Disclosure Number: IPCOM000091544D
Original Publication Date: 1968-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

This method is for forming pretreated, TEFLON* coated wire into coaxial cable after the pretreated wire is automatically wire-wrapped in position. The coaxial shielded cable is further treated to provide a common ground. The method is shown in connection with printed circuit board 12 having pins 14 by which connections are made to such board. Heat shrinkable insulative plastic sleeves 16 are shrunk around pins 14. Common wire ground plane 18 is insulated from pins 14 and from internal signal plane board 20. Before automatic wire wrapping, coated wire 22 is prepared for electroless plating by sensitizing with stannous chloride or its equivalent and then catalyzing with palladium chloride or its equivalent. Treated wire 22 is then wrapped into position on board 12.

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Process of Making Coaxial Cable in Place

This method is for forming pretreated, TEFLON* coated wire into coaxial cable after the pretreated wire is automatically wire-wrapped in position. The coaxial shielded cable is further treated to provide a common ground. The method is shown in connection with printed circuit board 12 having pins 14 by which connections are made to such board. Heat shrinkable insulative plastic sleeves 16 are shrunk around pins 14. Common wire ground plane 18 is insulated from pins 14 and from internal signal plane board 20. Before automatic wire wrapping, coated wire 22 is prepared for electroless plating by sensitizing with stannous chloride or its equivalent and then catalyzing with palladium chloride or its equivalent. Treated wire 22 is then wrapped into position on board
12. Pin tips 24, holes and crevices are masked and the board 12 surface is sealed off. The unit, consisting of board 12, pins 14 and wiring 22, is placed in a plating bath where electroless copper-plating of the wires takes place while the unit is being vibrated, thus forming coaxial wiring. The wiring is further electroplated with a low-temperature melt solder. The wiring is solder-fused together by applying heat and is thus bonded to plane 18. *Trademark of E.I. du Pont de Nemours and Co.

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