Browse Prior Art Database

Vapor Proof Venting Valve

IP.com Disclosure Number: IPCOM000091561D
Original Publication Date: 1968-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

This venting valve prevents the passage of vapor through it by condensation of the vapor in the valve. The device can be utilized wherever venting is required, but loss of liquid is prohibited. For example, the new low-boiling point liquids generally evaporate at room temperatures and, therefore, require such a venting valve.

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Vapor Proof Venting Valve

This venting valve prevents the passage of vapor through it by condensation of the vapor in the valve. The device can be utilized wherever venting is required, but loss of liquid is prohibited. For example, the new low-boiling point liquids generally evaporate at room temperatures and, therefore, require such a venting valve.

The venting valve, drawing B has a narrow dimension X extending between front and back plates 12 and 13 in comparison to its width Y. Along width Y, there is a plurality of condensing fins 16. Each is attached to plates 12 and 13. Fins 16 are parallel to one another and form an acute angle with the horizontal. The angle is sufficiently large so that water droplets 26, formed as a result of condensation of vapor 28, run to the low side of a fin 16 and drip down to the bottom of the vent valve and ultimately out opening 18 back to a container.

In drawing A, vaporized liquid 28, from any container to which the vent valve is attached, rises through opening 18 into the venting valve where vapors 28 contact cooled fin surfaces 16 and condense. Thus, venting is provided but the liquid does not escape. The surfaces, including fins 16, are maintained at a sufficiently cooled temperature to provide the condensation. Thermoelectric devices 22 can be used which are connected directly to back wall 13 where they essentially pump heat to heat sink 24. A chilled water or other cooling system can be utilized in place of devices 22....