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Thermal Card and Deflector System for Augmenting Immersion Cooling

IP.com Disclosure Number: IPCOM000091563D
Original Publication Date: 1968-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 87K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

This augmentative system improves the cooling of immersed electronic components carried by predetermined cards. The system includes thermal plate 12 which can be inserted into cooling liquid 14 adjacent card-mounted components 16 requiring increased cooling. Plate 12 has inlet 18 and outlet 20 so located that chilled water can be circulated through it. The surface of plate 12 facing components 16, to be cooled, has fins 22. The latter provide additional cooling by absorbing the heat carried from components 16 by the boiling bubbles.

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Thermal Card and Deflector System for Augmenting Immersion Cooling

This augmentative system improves the cooling of immersed electronic components carried by predetermined cards. The system includes thermal plate 12 which can be inserted into cooling liquid 14 adjacent card-mounted components 16 requiring increased cooling. Plate 12 has inlet 18 and outlet 20 so located that chilled water can be circulated through it. The surface of plate 12 facing components 16, to be cooled, has fins 22. The latter provide additional cooling by absorbing the heat carried from components 16 by the boiling bubbles.

Bubble deflectors 24 are located at spaced vertical positions along module card 26, preferably between components 16. Deflectors 24 cause the boiling bubbles generated at the component below to be deflected outward from components 16 so that they are intercepted by fins 22 on plate 12. Deflectors 24 also prevent the bubbles from forming a thermal boundary along the above positioned components.

Deflectors 24 can be made of either a metal or a plastic. They need only be sufficiently long so as to extend beyond components 16 so that they can intercept and deflect the boiling bubbles.

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