Browse Prior Art Database

Electroplating Method

IP.com Disclosure Number: IPCOM000091582D
Original Publication Date: 1968-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Pilgram, H: AUTHOR

Abstract

A continuous electroplating process for manufacturing flexible electric tape conductors and flexible electric circuits is provided. This is realized by use of a rotary metallic substrate having a photographically applied resist pattern. The negative of the product pattern required is photographically applied to surface 4 of rotating drum 1. The latter is mounted in tank 2 having galvanic bath 3. Drum 1 serves as a cathode and element 5 in bath 3 is the anode. A conductive metallic layer, some microns thick, is formed on surface 4 of drum 1 in accordance with the pattern applied.

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Electroplating Method

A continuous electroplating process for manufacturing flexible electric tape conductors and flexible electric circuits is provided. This is realized by use of a rotary metallic substrate having a photographically applied resist pattern. The negative of the product pattern required is photographically applied to surface 4 of rotating drum 1. The latter is mounted in tank 2 having galvanic bath 3. Drum 1 serves as a cathode and element 5 in bath 3 is the anode. A conductive metallic layer, some microns thick, is formed on surface 4 of drum 1 in accordance with the pattern applied.

After the plated surface of drum 1 passes through scavenging zone 6 and drying zone 7, a continually introduced insulating tape 8 is applied by roller 9 and pressure plate 10. Tape 8 has an adhesive surface and, when it is lifted from drum 1 by rollers 11 and 12, it strips the conductive layer from such drum. The tape-conductive layer laminate thus formed can be protected by a second insulating tape 13 joined to the first to completely cover the pattern. Roll pair 12 and oven 14 perform this final laminating step.

The tape conductor pattern can consist of a number of parallel disposed conductors of 40 microns in thickness, 100 microns in width, at a distance of 200 microns between the center lines. Copper, nickel or Cu-Ni alloys, gold, silver and tin alloys, as well as, for storage elements, nickel-iron and nickel-cobalt alloys are particularly suitable for electropl...