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Steel Chip Insertion Apparatus for Cards

IP.com Disclosure Number: IPCOM000091586D
Original Publication Date: 1968-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Paulson, TM: AUTHOR

Abstract

Apparatus, including differential heat sealing devices, affixes carbon steel chips within recesses in the edges of a tabulating card without warping the cardstock. In top view A and side view B, cards 1 from stack 2 are fed singly by rolls 3a and 3b between lateral guides 4. Each card 1 moves successively into rolls 5a and 5b that cut a rectangular notched recess 6 into each side of the card, then between abrading rolls 7a and 7b that abrade ledges 8 in the card around the three sides of each recess, and thence to an insertion station. Here, MYLAR* chips 9 of proper length are cut from roll 10 by cutters 11 and locally heated at their ends by heated parts 12a of tacking roll 12 to tack them in nested relation in the card in overlying relation to a respective ledge 8.

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Steel Chip Insertion Apparatus for Cards

Apparatus, including differential heat sealing devices, affixes carbon steel chips within recesses in the edges of a tabulating card without warping the cardstock. In top view A and side view B, cards 1 from stack 2 are fed singly by rolls 3a and 3b between lateral guides 4. Each card 1 moves successively into rolls 5a and 5b that cut a rectangular notched recess 6 into each side of the card, then between abrading rolls 7a and 7b that abrade ledges 8 in the card around the three sides of each recess, and thence to an insertion station. Here, MYLAR* chips 9 of proper length are cut from roll 10 by cutters 11 and locally heated at their ends by heated parts 12a of tacking roll 12 to tack them in nested relation in the card in overlying relation to a respective ledge 8. Meanwhile, steel chips 13 are urged upwardly into the card feed path from stack 14 by spring 15 and enter into a respective recesses 6 as the card passes over such chips.

The card, with chips 9 and 13 nested, is then advanced between heating units 16 and 17 which are moved toward each other to bond such chips in place. Unit 16 has heating surfaces coextensive with those of MYLAR chips 9 and is heated to 250 degrees F. Unit 17 has heating surfaces coextensive only with those of the steel chips 13 and is heated to 400 degrees F, with the area around the heating surfaces being an insulated platform 18.

This differential heat sealing prevents warpage of the cardst...