Browse Prior Art Database

Combined Memory Core Plane and Circuit Module

IP.com Disclosure Number: IPCOM000091620D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Betz, RJ: AUTHOR

Abstract

This ceramic module 10 functions as a circuit module and a core plane frame. One side of module 10 contains a cavity 12 over which cores 14 are suspended on the drive and sense wires of the core array. The bottom of cavity 12 is metalized to serve as a ground plane. Pads 16 are provided around the perimeter of cavity 12 for bonding and welding to the array wires. Pads 16 are connected by plated through-holes to the other side of module 10 where monolithic circuit chips 18 are mounted. Electrical connections to chips 18 and the array wires are made to voltage pins 20 attached to module 10 by brazing.

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Combined Memory Core Plane and Circuit Module

This ceramic module 10 functions as a circuit module and a core plane frame. One side of module 10 contains a cavity 12 over which cores 14 are suspended on the drive and sense wires of the core array. The bottom of cavity 12 is metalized to serve as a ground plane. Pads 16 are provided around the perimeter of cavity 12 for bonding and welding to the array wires. Pads 16 are connected by plated through-holes to the other side of module 10 where monolithic circuit chips 18 are mounted. Electrical connections to chips 18 and the array wires are made to voltage pins 20 attached to module 10 by brazing.

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