Browse Prior Art Database

Interconnection Decal Employing Silicon Adhesive

IP.com Disclosure Number: IPCOM000091628D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Chiou, C: AUTHOR [+4]

Abstract

A silicon adhesive is employed as the separating layer in an interconnecting decal. Decals are employed in the formation of a mechanical and electrical interconnection between spaced conductors such as the contacts of a semiconductive chip device and the contact areas of a conductive pattern formed on a supporting insulating substrate, typically ceramic.

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Interconnection Decal Employing Silicon Adhesive

A silicon adhesive is employed as the separating layer in an interconnecting decal. Decals are employed in the formation of a mechanical and electrical interconnection between spaced conductors such as the contacts of a semiconductive chip device and the contact areas of a conductive pattern formed on a supporting insulating substrate, typically ceramic.

The fabrication of one such decal, as in A, involves the bonding of conductive layer 11, typically gold foil 0.0005'' thick, to temporary carrier film 12 as of polyamide film by an adhesive 13 such as XR-6H049 a product of Dow Corning Corp. A silicon adhesive is particularly advantageous due to its thermal stability and ease of removal from the temporary carrier.

After bonding or lamination of foil 11 to film 12, such foil is photoetched to form interconnectors 14 in the desired pattern as in B. The decal is then placed over a chip bearing substrate 15 as in C. The interconnectors 14 are brought into contact with respective contact 16 and land 17 portions and firmly connected to them as by thermo-compression bonding. Then film 12 is removed from interconnectors 14, as by dissolving the adhesive, leaving such interconnectors firmly bonded to the contacts and lands.

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