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Browse Prior Art Database

Paste Adhesion Certification

IP.com Disclosure Number: IPCOM000091641D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Altmann, EK: AUTHOR

Abstract

For the purpose of testing the strength of paste adhesion in the shear mode at sites for backside-down mounted chips or pads, parts made of copper are substituted for conventional semiconductor chips. Such substitution insures that failure of the bond occurs at the paste-substrate interface rather than at the metallurgy of the chip. However, the backside metallurgy of the devices is approximated as far as possible by evaporating gold onto the copper surface to be bonded. A further simulation of the semiconductor chip is achieved by oxidizing the copper chips at elevated temperatures, a measure which prevents the solder from wetting the edges of the chip.

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Paste Adhesion Certification

For the purpose of testing the strength of paste adhesion in the shear mode at sites for backside-down mounted chips or pads, parts made of copper are substituted for conventional semiconductor chips. Such substitution insures that failure of the bond occurs at the paste-substrate interface rather than at the metallurgy of the chip. However, the backside metallurgy of the devices is approximated as far as possible by evaporating gold onto the copper surface to be bonded. A further simulation of the semiconductor chip is achieved by oxidizing the copper chips at elevated temperatures, a measure which prevents the solder from wetting the edges of the chip. Use of the technique avoids the destruction of good semiconductor chips for testing purposes while resulting in a sounder test for bond strength than if actual semiconductor chips are used.

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