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Sliced Laminate, Printed Circuit Interconnections

IP.com Disclosure Number: IPCOM000091658D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Peter, AE: AUTHOR [+2]

Abstract

Printed circuit interconnections are formed by laminating a plurality of sheets having conductive lines. Then slices are severed at right angles to the conductor length to provide a substrate with conductive pins extending through the slices. A plurality of dielectric sheets 1, having printed circuit lines 2, is laminated with alternate dielectric sheets 3 to form block 4. The latter is sliced normal to lines 2 to provide sheets 5 with through-conductors 6. To connect two or more adjacent conductors, lines 7 are added to the printed circuit sheets prior to lamination. The slices provide bases with through-connectors for the application of additional printed circuits on their surfaces.

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Sliced Laminate, Printed Circuit Interconnections

Printed circuit interconnections are formed by laminating a plurality of sheets having conductive lines. Then slices are severed at right angles to the conductor length to provide a substrate with conductive pins extending through the slices. A plurality of dielectric sheets 1, having printed circuit lines 2, is laminated with alternate dielectric sheets 3 to form block 4. The latter is sliced normal to lines 2 to provide sheets 5 with through-conductors 6. To connect two or more adjacent conductors, lines 7 are added to the printed circuit sheets prior to lamination. The slices provide bases with through-connectors for the application of additional printed circuits on their surfaces.

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