Browse Prior Art Database

Air Cooled Circuit Package

IP.com Disclosure Number: IPCOM000091713D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Witts, GR: AUTHOR

Abstract

Four parallel rows of circuit modules 10...13 are supported and interconnected by printed circuit board 14. Each module has cooling fins 15 extending in a direction transverse to rows 10...13. Inner rows 11 and 12 are spaced apart to accommodate air distribution tube 16. The latter is pivoted relative to board 14 so that it can be moved away for easy access to the modules. Flanges 17 and 18 abut fins 15 to define air passages extending transversely of rows 10...13. Cooling air is passed along tube 16 in the direction of decreasing cross-sectional area and exhausted through apertures 19 and between adjacent fins 15.

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Air Cooled Circuit Package

Four parallel rows of circuit modules 10...13 are supported and interconnected by printed circuit board 14. Each module has cooling fins 15 extending in a direction transverse to rows 10...13. Inner rows 11 and 12 are spaced apart to accommodate air distribution tube 16. The latter is pivoted relative to board 14 so that it can be moved away for easy access to the modules. Flanges 17 and 18 abut fins 15 to define air passages extending transversely of rows 10...13. Cooling air is passed along tube 16 in the direction of decreasing cross-sectional area and exhausted through apertures 19 and between adjacent fins 15.

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