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Modules with Increased Energy Dissipation

IP.com Disclosure Number: IPCOM000091718D
Original Publication Date: 1968-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Spielmann, WK: AUTHOR [+2]

Abstract

Several solutions are known to the problem of transferring the heat resulting from energy dissipation in integrated circuits. Thus, for example, a heat sink is realized by arranging a heat-conducting spring between the chip and the module housing. Other solutions consist in the chip being placed on its back and in wires used between the pads and conductors. However, the latter solution in particular has certain production problems. A different arrangement of a module is that in which the conductors are glass-insulated. An Al foil 1 is soldered at about 300 degrees C to the back of the chip and clamped in case 2, ensuring a good heat transfer. In order to render the heat sink more effective, case 2 is glued to the Al(2)O(3) substrate by a suitable plastics adhesive.

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Modules with Increased Energy Dissipation

Several solutions are known to the problem of transferring the heat resulting from energy dissipation in integrated circuits. Thus, for example, a heat sink is realized by arranging a heat-conducting spring between the chip and the module housing. Other solutions consist in the chip being placed on its back and in wires used between the pads and conductors. However, the latter solution in particular has certain production problems. A different arrangement of a module is that in which the conductors are glass-insulated. An Al foil 1 is soldered at about 300 degrees C to the back of the chip and clamped in case 2, ensuring a good heat transfer. In order to render the heat sink more effective, case 2 is glued to the Al(2)O(3) substrate by a suitable plastics adhesive. An adhesive consisting of a mixture of Al and polyamide, increasing the heat conductivity, can, for example, be used for this purpose.

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