Browse Prior Art Database

Ultrasonic Bonding Tip

IP.com Disclosure Number: IPCOM000091772D
Original Publication Date: 1968-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Ho, VT: AUTHOR [+2]

Abstract

Ultrasonic bonding tip 10 grasps wire 12 and, by vibration, bonds wire 12 to supporting substrate 14. Tip 10 has a particular groove structure. A plurality of radii 16 and 18 is formed at opposed ends of groove 20 in tip 10. The two radii eliminate any shear force on wire 12 during the bonding operation.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Ultrasonic Bonding Tip

Ultrasonic bonding tip 10 grasps wire 12 and, by vibration, bonds wire 12 to supporting substrate 14. Tip 10 has a particular groove structure. A plurality of radii 16 and 18 is formed at opposed ends of groove 20 in tip 10. The two radii eliminate any shear force on wire 12 during the bonding operation.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]