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Control of Edge Profile in Sputter Etching

IP.com Disclosure Number: IPCOM000091824D
Original Publication Date: 1968-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Valletta, RM: AUTHOR

Abstract

This method is for forming sloping edges on films during sputter etching. It is useful in sloping the edges of apertures in insulating films on semiconductors. Sputter etching is a useful technique in semiconductor fabrication for the formation of apertures in films, surface cleanup, resistor trimming, etc. One of the advantages of the technique is that there is no undercutting of the film as in chemical etching. However, in some instances a sloping edge is desirable.

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Control of Edge Profile in Sputter Etching

This method is for forming sloping edges on films during sputter etching. It is useful in sloping the edges of apertures in insulating films on semiconductors. Sputter etching is a useful technique in semiconductor fabrication for the formation of apertures in films, surface cleanup, resistor trimming, etc. One of the advantages of the technique is that there is no undercutting of the film as in chemical etching. However, in some instances a sloping edge is desirable.

This method consists of adjusting the pressure of the chamber so that sloping edges are formed. High pressures result in large slopes. Low pressures result in very steep slopes.

The direction of gas ions in a sputtering system is influenced by the gas pressure. At pressures of approximately 10 mu, the gas ions traverse through the dark space in a straight line and, in the usual system, strike the cathode in a path generally perpendicular to such electrode. At higher pressures the ions suffer collisions on their path to the cathode and their direction is more random. Thus the steepness of the edge is controlled by the direction of the sputtered atoms, which is in turn dependent on pressure. The variations of pressure to control edge slope is applicable to both RP and DC sputter etching.

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