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Browse Prior Art Database

Making Interconnections in Multilayer Boards

IP.com Disclosure Number: IPCOM000091833D
Original Publication Date: 1968-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Reinhart, FM: AUTHOR

Abstract

This method permits two or more independent connections to be made in the same plated hole of a multilayer printed circuit board. Alternatively, components can be imbedded in a circuit board and suitably interconnected. The method reduces impedance discontinuity in interconnecting circuits and components.

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Making Interconnections in Multilayer Boards

This method permits two or more independent connections to be made in the same plated hole of a multilayer printed circuit board. Alternatively, components can be imbedded in a circuit board and suitably interconnected. The method reduces impedance discontinuity in interconnecting circuits and components.

Multilayer printed circuit board 20 includes conductive planes 22, 24, and 26 spaced from one another by insulating layers 28. A throughhole is formed in board 20 and passes through all conductive planes. The hole is plated to form a connection among the planes. Discrete connections can be formed among the planes by establishing grooves 32 in the plating. A groove 32 electrically isolates the conductive planes on one end of board 20 from the other end. More than two grooves 32 can be established in the hole to form other independent interconnections.

A groove 32 can be formed in the plating by a broaching tool having a cylindrical body fitting the inside diameter of the throughhole. Two sets of tapered teeth formed on the body permit grooves or key slots 32 to be formed in the plating.

Split pin 34 with protruding insulation can be inserted into the through-hole and registered into the grooves. Pin 34 can be soldered in place. The protruding insulation prevents solder bridging. Pin 34 also permits components attached to the exterior surface of the board to be joined to conductive layers 22.

Alternatively, ferrite core...