Browse Prior Art Database

Silver Halide Photoresist

IP.com Disclosure Number: IPCOM000091872D
Original Publication Date: 1968-Jun-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Herd, HH: AUTHOR

Abstract

In this method of photoetching, a photoresist for preparing high-resolution printing plates.

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Silver Halide Photoresist

In this method of photoetching, a photoresist for preparing high-resolution printing plates.

A silver halide emulsion is prepared by suspending AgNo(3) in a gelatin solution to which is added KBr and KI. The emulsion is coated onto a metal substrate, such as chromium and copper, as a film. Where the metal substrate is prepared from chromium, the emulsion film is exposed to actinic radiation under a predetermined pattern. The exposed film is developed in a nontanning developer such as Kodak's high resolution Developer. The film is next tanned in a bath comprising CrO(3) 20 g

NaCl 50 g

Na()SO(3) 1 g

H(2) 2 liters.

Fixing of the image is then accomplished by immersing the film in a 10% aqueous NH(4)CNS bath. The resulting relief image is hardened by heating at a temperature of from 230 degrees C to 260 degrees C.

Where the metal substrate is prepared from copper, the image is developed in a tanning bath comprising Pyrogallol 6 g/l

Metol 4 g/l

K(2)CO(3)x3/2H(2)O 50 g/l.

Fixing of the image is unnecessary in the case where the copper is to be etched. Hardening of the image is effected by heating as in the case of the chromium substrate.

The exposed metal substrate is then etched. Where the metal is copper, a 2 molar CuCl(2) solution saturated with NaCl is used as the etchant. Etching occurs at temperatures of from 25 degrees C to 35 degrees C. Where the metal is chromium, a saturated CaCl(2) solution with 6% HCl is used as the etchant.

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