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Browse Prior Art Database

Plated Copper Artwork

IP.com Disclosure Number: IPCOM000091880D
Original Publication Date: 1968-Jun-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

McClurg, RH: AUTHOR

Abstract

Photo artwork for use in the manufacture of electronic circuitry or devices can be laid out on an oversized scale by the use of a line drawing plotting machine. In order to provide the required definition, the automatic plotter can be set to draw a very fine line which is in fact an outline of the final line to be seen in the artwork. It then remains to fill in the areas of those artwork lines, within the boundaries of the fine lines drawn by the plotter. This can be done by a series of masking and etching steps.

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Plated Copper Artwork

Photo artwork for use in the manufacture of electronic circuitry or devices can be laid out on an oversized scale by the use of a line drawing plotting machine. In order to provide the required definition, the automatic plotter can be set to draw a very fine line which is in fact an outline of the final line to be seen in the artwork. It then remains to fill in the areas of those artwork lines, within the boundaries of the fine lines drawn by the plotter. This can be done by a series of masking and etching steps.

The plotter is utilized to draw outlines 10 and 12 of circuit element forms on transparent substrate 14. In order to accommodate a later plating step of the process, an opening 16 is left in any pattern, such as pattern 12, which would otherwise completely encircle another pattern.

In the second step, a MYLAR* substrate having a cladding of copper 18 is photoetched in accordance with the artwork produced in the first step to remove the copper in the areas 20 and 22 corresponding to the line work 10 and 12. This photoetching step electrically isolates the copper areas 24 and 26, bounded by the etched lines, from the remaining background copper 18.

In the next step, cathodic connection is made to copper 18, in an electroplating bath in which nickel 28 is plated onto the background areas. Since there is no electrical connection to areas 24 and 26, they are not plated with nickel.

In the following step, the plated laminate is subjected...