Browse Prior Art Database

Soldering Tool

IP.com Disclosure Number: IPCOM000091915D
Original Publication Date: 1968-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Jensen, NF: AUTHOR

Abstract

The apparatus supplies a removable source of heat to articles. Pins 10 of upper module 11 are to be bonded to the surface of lower module 12 in order to provide a piggy-back structure. Solder mounds 13 are applied to the surface of module 12. Then, module 11 is placed on the surface of module 12 so that pins 10 are in registration with mounds 13. Structural devices can be used to bring module 11 into registration with module 12, e.g., indentations in the surface of module 12 to seat the pins. Movable heating strip 14 carried on holder 15 is then lowered as shown in which it surrounds the composite module structure. The walls of strip 14 in combination with modules 11 and 12 form an oven enclosing intermediate space 16.

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Soldering Tool

The apparatus supplies a removable source of heat to articles. Pins 10 of upper module 11 are to be bonded to the surface of lower module 12 in order to provide a piggy-back structure. Solder mounds 13 are applied to the surface of module 12. Then, module 11 is placed on the surface of module 12 so that pins 10 are in registration with mounds 13. Structural devices can be used to bring module 11 into registration with module 12, e.g., indentations in the surface of module 12 to seat the pins. Movable heating strip 14 carried on holder 15 is then lowered as shown in which it surrounds the composite module structure. The walls of strip 14 in combination with modules 11 and 12 form an oven enclosing intermediate space 16. The heat within this oven melts mounds 13, after which strip 14 is raised out of engagement with the modules. The solder cools, providing a bond between the pins 10 of module 11 and the surface of module
12.

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