Browse Prior Art Database

Transformer

IP.com Disclosure Number: IPCOM000091919D
Original Publication Date: 1968-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Hayunga, CP: AUTHOR

Abstract

In this transformer package, four ceramic substrates each bear a pulse transformer 12, Substrates 10 are placed on edge and in grooves in substrate 16. In order to facilitate interconnection to either side of a substrate, grooves 14 are located between inner pins 22 and outer pins 24. The transformer package is joined together by reflow soldering in a furnace. For added rigidity, copper rivet 18 is placed through substrate 16 prior to reflow soldering. Rivet 18 contacts, under tension, against the other four substrates when the package is cooled from the furnace.

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Transformer

In this transformer package, four ceramic substrates each bear a pulse transformer 12, Substrates 10 are placed on edge and in grooves in substrate
16. In order to facilitate interconnection to either side of a substrate, grooves 14 are located between inner pins 22 and outer pins 24. The transformer package is joined together by reflow soldering in a furnace. For added rigidity, copper rivet 18 is placed through substrate 16 prior to reflow soldering. Rivet 18 contacts, under tension, against the other four substrates when the package is cooled from the furnace.

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