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Cermet Substrate Smoothing for Electroplated Magnetic Films

IP.com Disclosure Number: IPCOM000091946D
Original Publication Date: 1968-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bertelsen, BI: AUTHOR

Abstract

A cermet consisting of a noble metal, such as gold, platinum, or palladium in matrix of silicon monoxide or other high resistivity material can be used as a smoothing layer for electroplated magnetic films. Use of such a cermet smoothing layer gives the combination of small grain size in the electroplated magnetic film and a conductive layer between the substrate and the magnetic film in a one-step process. The cermet can also be used as a conductive starting layer for electrodepositing films on an insulated substrate, e.g., a copper plate with a silicon monoxide insulating layer thereon. Flash evaporation or DC and RF sputtering techniques can be used to deposit the cermet on the substrate prior to deposition of the magnetic film. For a typical polished copper substrate, a thickness of the order of two microns is needed.

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Cermet Substrate Smoothing for Electroplated Magnetic Films

A cermet consisting of a noble metal, such as gold, platinum, or palladium in matrix of silicon monoxide or other high resistivity material can be used as a smoothing layer for electroplated magnetic films. Use of such a cermet smoothing layer gives the combination of small grain size in the electroplated magnetic film and a conductive layer between the substrate and the magnetic film in a one-step process. The cermet can also be used as a conductive starting layer for electrodepositing films on an insulated substrate, e.g., a copper plate with a silicon monoxide insulating layer thereon. Flash evaporation or DC and RF sputtering techniques can be used to deposit the cermet on the substrate prior to deposition of the magnetic film. For a typical polished copper substrate, a thickness of the order of two microns is needed.

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